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An advanced form of radio frequency silicon on insulator (RF SOI) that enables the intelligent integration of RF, digital and analog components onto a single chip. It is used for the following applications: mobile, wireless infrastructure, land mobile radios, broadband, Wi-Fi, test and measurement, automotive, medical, smart energy, Internet of Things, military, radar and space. The technology enables engineers to prioritize small form factor, low power consumption, high reliability, radiation-hardened, high ESD ratings, programmability, affordability, reduced board area and other factors based on use case.

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